Doublecheck Semiconductors (DCS) is a privately held company located in Berlin. DCS provides a new design and process flow to allow for carrier-less wafer processing down to 50µm and less. DCS technology has the full capability of being integrated into the "backend" process flow for RDL, bumping and backside metallization in power applications. This patent pending technology is used in TSV/3D and power semiconductors, where ultra-thin wafers are processed at the front and back side.
DCS makes use of production semiconductor equipment and processes already existing in high volume production lines. The new DCS process flow shortens development time and reduces manufacturing costs for backside processing of thin wafers decisively. Cost intensive and tailor-made carriers and adhesives are no more needed in TSV and power semiconductor production.